1. 2. 3. material content data sheet sales product name 2edl05i06pj issued 29. august 2013 ma# MA001136736 package pg-dso-14-49 weight* 138.83 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.952 0.69 0.69 6858 6858 leadframe inorganic material phosphorus 7723-14-0 0.014 0.01 103 non noble metal zinc 7440-66-6 0.057 0.04 414 non noble metal iron 7439-89-6 1.150 0.83 8280 non noble metal copper 7440-50-8 46.675 33.62 34.50 336194 344991 wire noble metal gold 7440-57-5 0.228 0.16 0.16 1644 1644 encapsulation organic material carbon black 1333-86-4 0.175 0.13 1263 plastics epoxy resin - 9.470 6.82 68209 inorganic material silicondioxide 60676-86-0 78.036 56.21 63.16 562090 631562 leadfinish non noble metal tin 7440-31-5 1.226 0.88 0.88 8832 8832 plating noble metal silver 7440-22-4 0.307 0.22 0.22 2208 2208 glue plastics acrylic resin - 0.119 0.09 859 noble metal silver 7440-22-4 0.423 0.30 0.39 3046 3905 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
